Lead-Free RoHS Compliant Products:

The LF suffix on RO model numbers designates part numbers that are both “lead free” and are in compliance with the European Union Directive, 2002/95/EC on the Restricted use Of Hazardous Substances in electrical and electronic equipment (RoHS).  

We certify that our lead free RoHS compliant products are not intentionally manufactured with and do not contain concentrations of the 6 substances banned by the RoHS directive in excess of the regulatory limits except where specifically exempted by the directive.

 The 6 banned substances are:

• Lead
• Mercury
• Cadmium
• Hexavalent Chromium
• Polybrominated Biphenyls (PBB’s)
• Polybrominated Diphenyl Ethers (PBDE’s)

Part number examples:

               nV300-5LF
               PFC-600LF

Click here for pdf version of compliance statement 

5/6 RoHS Compliant Products
The RoHS directive and it’s amendments allow for certain lead in solder exemptions for roughly the next four years (to be reviewed 2009).  Specifically, the following lead in solder exemptions are made: 

• Lead in high melting temperature type solders (i.e. lead-based alloys containing 85% by weight or more lead)
• Lead in solders for servers, storage array systems, network infrastructure equipment for switching, signaling, transmission as well as network management for telecommunications

The first is commonly used for die attach solder in semiconductors.  The second exemption listed above is commonly referred to as the “server exemption”. 

RO has an ongoing program to provide “5/6” RoHS compliant products for our customers that are taking the lead in solder “server exemption”.  Such products are manufactured with tin-lead solder and a tin-lead solder process but do not contain any of the other 5 substances prohibited by the RoHS directive and are therefore termed 5/6 RoHS compliant.  There is no part number change for 5/6 compliant products.  RO operates it's 5/6 compliance program on an as-needed basis.  Customers who have a need for 5/6 compliant products should contact the factory for more information regarding available products or design conversions.

Solder Process Compatibility and 2^nd Level Interconnect
RO lead free RoHS compliant through hole products have gold plating on the module pins (JESD97 2^nd level interconnect category e4).  The high current copper alloy pins are gold-over-nickel plated while the lower current brass alloy signal pins are gold plated.  They are intended for SnAgCu lead-free wave soldering but are also backward compatible with SnPb solder processes. 

Product and packaging marking
The LF suffix to the model number will be marked on the module label on all lead free RoHS compliant products.  Additionally the module label will bear the JEDEC Standard JESD97 Pb-free symbol. 

The packaging for lead free RoHS compliant products will be marked with a label in accordance with JEDEC JESD97 Marking, symbols and labels for identification of lead-free assemblies, components and devices.  This label will contain the Pb-free symbol, the words RoHS Compliant as well as the 2^nd level interconnect information.